This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.

Website: https://www.deepmaterialcn.com/epoxy-underfill-chip-level-adhesives.html

https://www.youtube.com/@epoxyunderfillchipleveladhesiv/about

https://www.pinterest.com/epoxyunderfillchipleveladhesiv/